AS4C256M16D3LB-12BCN, AS4C256M16D3LB-12BIN 4Gb DRAM

Alliance Semiconductor

Description

AS4C256M16D3LB-12BIN AS4C256M16D3LB-12BCN Revision History 4Gb AS4C256M16D3LB - 12BIN/BCN 96 ball FBGA PACKAGE Revision Rev 1.0 Rev 1.1 Details Pre.
Pin CK, CK CKE CS ODT RAS, CAS, WE DM (DMU), (DML) Type Input Input Input Input Input Input Function Clock : CK and CK are differential clock input.

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AS4C256M16D3LB-12BCN Datasheet Preview — This datasheet PDF includes multiple part numbers: AS4C256M16D3LB-12BCN, AS4C256M16D3LB-12BIN. Please refer to the document for exact specifications by model.

Datasheet Specifications

Part number: AS4C256M16D3LB-12BCN, AS4C256M16D3LB-12BIN
Manufacturer: Alliance Semiconductor
File Size: 2.37 MB
Datasheet: AS4C256M16D3LB-12BIN-AllianceSemiconductor.pdf
Description: 4Gb DRAM
Note: This datasheet PDF includes multiple part numbers: AS4C256M16D3LB-12BCN, AS4C256M16D3LB-12BIN.
Please refer to the document for exact specifications by model.

Features

* - Double-data-rate architecture; two data transfers per clock cycle - The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture - Bi-directional differential data strobe (DQS and DQS) is transmitted/received with data for capturing data at the receiver - DQS is edge-alig

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AS4C256M16D3LB-12BIN 4Gb DRAM Alliance Semiconductor

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