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PTFB211501F - Thermally-Enhanced High Power RF LDMOS FETs

Download the PTFB211501F datasheet PDF. This datasheet also covers the PTFB211501E variant, as both devices belong to the same thermally-enhanced high power rf ldmos fets family and are provided as variant models within a single manufacturer datasheet.

Description

The PTFB211501E and PTFB211501F are thermally-enhanced, 150-watt, LDMOS FETs designed for cellular power amplifier applications in the 2110

2170 frequency band.

Features

  • include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges. PTFB211501E Package H-36248-2 PTFB211501F Package H-37248-2 ACP (dBc) Drain Efficiency (%) Single-carrier WCDMA Drive Up VDD = 30 V, IDQ = 1.20 A, ƒ = 2170 MHz 3GPP WCDMA, PAR = 8.5 dB, BW 3.84 MHz -25 60 -30 50 -35 Efficiency 40 -40 30 -45 ACP Low 20 -50 10 ACP Up -55 0 31 33 35 37 39 41 43 45 47 49 Output Power (dBm) Features.
  • Broadband internal matching.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (PTFB211501E-Infineon.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number PTFB211501F
Manufacturer Infineon
File Size 349.42 KB
Description Thermally-Enhanced High Power RF LDMOS FETs
Datasheet download datasheet PTFB211501F Datasheet

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Full PDF Text Transcription

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PTFB211501E PTFB211501F Thermally-Enhanced High Power RF LDMOS FETs 150 W, 2110 – 2170 MHz Description The PTFB211501E and PTFB211501F are thermally-enhanced, 150-watt, LDMOS FETs designed for cellular power amplifier applications in the 2110 – 2170 frequency band. Features include I/O matching, high gain, and thermally-enhanced ceramic open-cavity packages with slotted and earless flanges. PTFB211501E Package H-36248-2 PTFB211501F Package H-37248-2 ACP (dBc) Drain Efficiency (%) Single-carrier WCDMA Drive Up VDD = 30 V, IDQ = 1.20 A, ƒ = 2170 MHz 3GPP WCDMA, PAR = 8.5 dB, BW 3.
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