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SE30PAD - Surface-Mount ESD Capability Rectifiers

This page provides the datasheet information for the SE30PAD, a member of the SE30PAB Surface-Mount ESD Capability Rectifiers family.

Features

  • Very low profile - typical height of 0.95 mm.
  • Ideal for automated placement.
  • Oxide planar chip junction.
  • Low forward voltage drop, low leakage current.
  • ESD capability.
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C.
  • Not recommended for PCB bottom side wave mounting.
  • AEC-Q101 qualified.
  • Material categorization: for definitions of compliance please see www. vishay. com/doc?99912.

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Datasheet preview – SE30PAD

Datasheet Details

Part number SE30PAD
Manufacturer Vishay
File Size 124.39 KB
Description Surface-Mount ESD Capability Rectifiers
Datasheet download datasheet SE30PAD Datasheet
Additional preview pages of the SE30PAD datasheet.

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Full PDF Text Transcription

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www.vishay.com SE30PAB, SE30PAD, SE30PAG, SE30PAJ Vishay General Semiconductor Surface-Mount ESD Capability Rectifiers eSMP® Series Top View Bottom View SMPA (DO-221BC) Anode Cathode DESIGN SUPPORT TOOLS click logo to get started Models Available PRIMARY CHARACTERISTICS IF(AV) 3.0 A VRRM 100 V, 200 V, 400 V, 600 V IFSM 32 A VF at IF = 3.0 A (TA = 125 °C) IR 1.00 V 5 μA TJ max. 175 °C Package SMPA (DO-221BC) Circuit configuration Single FEATURES • Very low profile - typical height of 0.
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