Datasheet4U Logo Datasheet4U.com

PTFA192001E - Thermally-Enhanced High Power RF LDMOS FET

Description

The PTFA192001E and PTFA192001F are 200-watt LDMOS FETs intended for single- and two-carrier WCDMA and CDMA applications from 1930 to 1990 MHz.

Features

  • include input and output matching, and thermally-enhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability. PTFA192001E Package H-36260-2 PTFA192001F Package H-37260-2 2-Carrier WCDMA Drive-up VDD = 30 V, IDQ = 1600 mA, ƒ = 1960 MHz, 3GPP WCDMA signal, P/A R = 8 dB, 10 MHz carrier spacing -25 30 Features.
  • 25 Pb-free, RoHS-compliant and therma.

📥 Download Datasheet

Datasheet Details

Part number PTFA192001E
Manufacturer Infineon
File Size 296.01 KB
Description Thermally-Enhanced High Power RF LDMOS FET
Datasheet download datasheet PTFA192001E Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
PTFA Plug Type Fixed Attenuator OPLINK
PTFA041501E Thermally-Enhanced High Power RF LDMOS FETs Infineon
PTFA041501F Thermally-Enhanced High Power RF LDMOS FETs Infineon
PTFA041501GL Thermally-Enhanced High Power RF LDMOS FETs Infineon
PTFA041501HL Thermally-Enhanced High Power RF LDMOS FETs Infineon

Other Datasheets by Infineon

Part Number Description
PTFA192001F Thermally-Enhanced High Power RF LDMOS FET
PTFA192401E Thermally-Enhanced High Power RF LDMOS FET
PTFA192401F Thermally-Enhanced High Power RF LDMOS FET
PTFA190451E Thermally-Enhanced High Power RF LDMOS FET
PTFA190451F Thermally-Enhanced High Power RF LDMOS FET

Full PDF Text Transcription

Click to expand full text
PTFA192001E PTFA192001F Confidential, Limited Internal Distribution Thermally-Enhanced High Power RF LDMOS FETs 200 W, 1930 – 1990 MHz www.DataSheet4U.net Description The PTFA192001E and PTFA192001F are 200-watt LDMOS FETs intended for single- and two-carrier WCDMA and CDMA applications from 1930 to 1990 MHz. Features include input and output matching, and thermally-enhanced packages with slotted or earless flanges. Manufactured with Infineon's advanced LDMOS process, these devices provide excellent thermal performance and superior reliability.
Published: |