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IXGH22N50B - HiPerFAST IGBT

Features

  • International standard packages JEDEC TO-247 SMD surface mountable and JEDEC TO-247 AD Maximum lead temperature for soldering 1.6 mm (0.062 in. ) from case for 10 s Md Weight Mounting torque (M3).
  • High frequency IGBT.
  • High current handling capability.
  • HiPerFAST HDMOS process.
  • MOS Gate turn-on TM TM - drive simplicity.

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Full PDF Text Transcription

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Preliminary data HiP erF ASTTM IGBT HiPerF erFAST IXGH22N50B IXGH22N50BS VCES IC(25) VCE(sat)typ tfi(typ) TO-247 SMD* = 500 V = 44 A = 2.1 V = 55 ns www.DataSheet4U.com Symbol VCES VCGR VGES VGEM IC25 IC90 ICM SSOA (RBSOA) PC TJ TJM Tstg Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C; RGE = 1 MΩ Continuous Transient TC = 25°C TC = 90°C TC = 25°C, 1 ms VGE = 15 V, TVJ = 125°C, RG = 22 Ω Clamped inductive load, L = 100 µH TC = 25°C Maximum Ratings 500 500 ±20 ±30 44 22 88 ICM = 44 A @ 0.8 VCES 150 -55 ... +150 150 -55 ... +150 300 1.13/10 TO-247 AD TO-247 SMD 6 4 W °C °C °C °C Nm/lb.in.
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