Datasheet Specifications
- Part number
- WED3C755E8M-XBX
- Manufacturer
- White Electronic Designs Corporation
- File Size
- 377.53 KB
- Datasheet
- WED3C755E8M-XBX_WhiteElectronicDesignsCorporation.pdf
- Description
- RISC MICROPROCESSOR MULTI-CHIP PACKAGE
Description
www.DataSheet4U.com White Electronic Designs WED3C755E8M-XBX RISC MICROPROCESSOR MULTI-CHIP PACKAGE OVERVIEW The WEDC 755E/SSRAM multichip package .
Features
* doze, nap, sleep and dynamic power management. The WED3C755E8M-XBX multichip package consists of: 755 RISC processor (E die revision) Dedicated 1MB SSRAM L2 cache, configured as 128Kx72 21mmx25mm, 255 Ceramic Ball Grid Array (CBGA) Core Frequency/L2 Cache Frequency (300MHz/ 150MHz, 350MHz/175MHz) MaApplications
* such as missiles, aerospace, flight computers, fire control systems and rugged critical systems. Footprint compatible with WED3C7558M-XBX and WED3C750A8M-200BX Footprint compatible with Motorola MPC 745 This product is subject to change without notice. FIG. 1 - MULTI-CHIP PACKAGE DIAGRAM SSRAM µP 75WED3C755E8M-XBX Distributors
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