Description
Third generation power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
The D2PAK (TO-263) is a surface mount power package
capable of accommodating die size up to HEX-4. It provides
the highest power capability and the lowest possible
on-resistance in any existing surface mount package.The
D2PAK (TO-263) is suitable for high current applications
because of its low internal connec
Features
- Surface mount.
- Available in tape and reel.
- Dynamic dV/dt rating.
- Repetitive avalanche rated
Available.
- Fast switching.
- Ease of paralleling.
- Simple drive requirement
Available.
- Material categorization: for definitions of
compliance please see www. vishay. com/doc?99912
Note.
- This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts.
SiHF840S_VishaySiliconix.pdf
