* Trench MOSFET technology
* Side wettable flanks for optical solder inspection
* Small and leadless ultra thin SMD plastic package: 2 x 2 x 0.65 mm
* AEC.

* Relay driver
* High-speed line driver
* High-side load switch
* Switching circuits 4. Quick reference.

P-channel enhancement mode Field-Effect Transistor (FET) in a leadless medium power DFN2020MD-6 (SOT1220) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology. 2. Features and benefits
* Trench MOSFET technology
* Side.

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