BUK9V13-40H datasheet, mosfet equivalent, nexperia

Features and benefits

* LFPAK56D package with half-bridge configuration enables:
* Reduced PCB layout complexity
* PCB shrinkage through reduced component footprint for 3-phase mot.

Application

D1 S1, D2 S2 aaa-028081 2. Features and benefits
* LFPAK56D package with half-bridge configuration enables:

Description

Dual, logic level N-channel MOSFET in an LFPAK56D package (half-bridge configuration), using Trench 9 TrenchMOS technology. This product has been designed and qualified to AEC-Q101. G1 An internal connection is made between the source (S1) of th.

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