SE30AFJ
FEATURES
Slim SMA
- Very low profile
- typical height of 0.95 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage current
- ESD capability
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DO-221AC
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
- Material categorization: For definitions of pliance please see .vishay./doc?99912
PRIMARY CHARACTERISTICS
IF(AV) VRRM IFSM VF at IF = 3.0 A (TA = 125 °C) IR TJ max. 3.0 A 100 V to 600 V 40 A 0.86 V 10 μA 175 °C
MECHANICAL DATA
Case: DO-221AC (Slim SMA) Molding pound meets UL 94 V-0 flammability rating Base P/N-M3
- halogen-free, Ro HS-pliant, and mercial grade Base P/NHM3
- halogen-free, Ro HS-pliant, and AEC-Q101 qualified Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: Color band denotes the cathode end
TYPICAL APPLICATIONS
General purpose, power...
