SE30AFJ Overview
Key Features
- Very low profile
- typical height of 0.95 mm
- Ideal for automated placement
- Oxide planar chip junction
- Low forward voltage drop, low leakage current
- ESD capability Top View Bottom View DO-221AC
- Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
- AEC-Q101 qualified
