TSF20U45C Features
* For surface mounted applications in order to optimize board space Low profile package Built-in strain relief Glass passivated junction Low inductance Typical IR less than 5.0uA above 11V High temperature soldering guaranteed: 260°C / 10 seconds at terminals Plastic package has Underwriters Laborator
TSF20U60C-TaiwanSemiconductor.pdf
Datasheet Details
TSF20U45C, TSF20U60C
Taiwan Semiconductor
254.28 KB
Trench mos barrier schottky rectifier.
This datasheet PDF includes multiple part numbers: TSF20U45C, TSF20U60C.
Please refer to the document for exact specifications by model.
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TSF20U45C Distributor
