* Small Chip
  – 170 x 170 x 50 μm
* Single Wire Bond Structure
* UT LED Performance
  – 450 nm
  – 12+ mW
 .

include consumer products, mobile devices and automotive applications where a small, thin form factor is required. FEAT.

P-N Junction Area (μm) Chip Top Area (μm) Chip Thickness (μm) Chip Bottom Area (μm) Au Bond Pad Diameter (μm) Bonding Area Diameter (μm) Note 5 Au Bond Pad Thickness (μm) Backside Contact Metal Area (μm) CxxxUT170-Sxxxx-31 Dimension Tolerance 140.

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