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TC74HC4049AP - HEX BUFFER/CONVERTER

General Description

2.

The TC74HC4049AP and TC74HC4050AP are high speed CMOS HEX BUFFERs fabricated with silicon gate C2MOS technology.

Key Features

  • (1) High speed: tpd = 9 ns (typ. ) at VCC = 5.0 V (2) Low power dissipation: ICC = 1.0 µA (max) at Ta = 25.
  • (3) High noise immunity: VNIH = VNIL = 28 % VCC (min) (4) Symmetrical Output impedance: |IOH| = IOL = 6 mA (min) (5) Balanced propagation delays: tPLH ≈ tPHL (6) Wide operating voltage range: VCC(opr) = 2.0 V to 6.0 V (7) Power-down protection is provided on all inputs. 4. Packaging DIP16 ©2020-2021 1 Toshiba Electronic Devices & Storage Corporation Start of commercial production.

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Full PDF Text Transcription for TC74HC4049AP (Reference)

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TC74HC4049AP,TC74HC4050AP CMOS Digital Integrated Circuits Silicon Monolithic TC74HC4049AP,TC74HC4050AP 1. Functional Description • Hex Buffer TC74HC4049AP: HEX BUFFER/CO...

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0AP 1. Functional Description • Hex Buffer TC74HC4049AP: HEX BUFFER/CONVERTER (INVERTING) TC74HC4050AP: HEX BUFFER/CONVERTER 2. General The TC74HC4049AP and TC74HC4050AP are high speed CMOS HEX BUFFERs fabricated with silicon gate C2MOS technology. They achieve the high speed operation similar to equivalent LSTTL while maintaining the CMOS low power dissipation. The TC74HC4049AP is an inverting buffer, while the TC74HC4050AP is a non-inverting buffer. The internal circuits are composed of 3-stages (TC74HC4049AP) or 2-stages (TC74HC4050AP) of inverter, which provided high noise immunity and stable output. Input protection c

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