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NSVBCP69T1G - PNP Transistor

Features

  • High Current: IC =.
  • 1.0 A.
  • The SOT.
  • 223 Package Can Be Soldered Using Wave or Reflow.
  • SOT.
  • 223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.
  • NPN Complement is BCP68.
  • AEC.
  • Q101 Qualified and PPAP Capable.
  • NSV Prefix for Automotive.

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Full PDF Text Transcription

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BCP69T1G, NSVBCP69T1G PNP Silicon Epitaxial Transistor This PNP Silicon Epitaxial Transistor is designed for use in low voltage, high current applications. The device is housed in the SOT−223 package, which is designed for medium power surface mount applications. Features • High Current: IC = −1.0 A • The SOT−223 Package Can Be Soldered Using Wave or Reflow. • SOT−223 package ensures level mounting, resulting in improved thermal conduction, and allows visual inspection of soldered joints. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die.
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