Download the MA4SPS502 datasheet PDF.
This datasheet also covers the MA4SPS502-MA variant, as both devices belong to the same pin diode family and are provided as variant models within a single manufacturer datasheet.
General Description
This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.
Key Features
Surface Mount Device.
No Wire Bonding Required.
Rugged Silicon-Glass Construction.
Silicon Nitride Passivation.
Polymer Scratch Protection.
Low Parasitic Capacitance and Inductance.
Higher Average and Peak Power Handling.
RoHS.
Compliant and 260°C Reflow Compatible
Case Style Outline Drawing ODS-12701,2.
Full PDF Text Transcription for MA4SPS502 (Reference)
Note: Below is a high-fidelity text extraction (approx. 800 characters) for
MA4SPS502. For precise diagrams, tables, and layout, please refer to the original PDF.
MA4SPS502 SURMOUNTTM PIN Diode Rev. V3 Features Surface Mount Device No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Poly...
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Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS* Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2 Description and Applications This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conducti
MA4SPS502 Datasheet
