Download the MA4SPS402 datasheet PDF.
This datasheet also covers the MA4SPS402-MA variant, as both devices belong to the same pin diode family and are provided as variant models within a single manufacturer datasheet.
General Description
This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.
Key Features
Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS Compliant.
Full PDF Text Transcription for MA4SPS402 (Reference)
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MA4SPS402. For precise diagrams, tables, and layout, please refer to the original PDF.
MA4SPS402 SURMOUNTTM PIN Diode RoHS Compliant Features Surface Mount No Wire Bonding Required Rugged Silicon-Glass Construction Silicon Nitride Passivation Poly...
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Rugged Silicon-Glass Construction Silicon Nitride Passivation Polymer Scratch Protection Low Parasitic Capacitance and Inductance Higher Average and Peak Power Handling RoHS Compliant Description This device is a Silicon-Glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss, low dispersion glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls electrically conductive. Selective backside metallization is applied producin
MA4SPS402 Datasheet
