Datasheet4U Logo Datasheet4U.com

IRL3102S - Power MOSFET

Description

These HEXFET Power MOSFETs were designed specifically to meet the demands of CPU core DC-DC converters.

Advanced processing techniques combined with an optimized gate oxide design results in a die sized specifically to offer maximum efficiency at minimum cost.

Features

  • . 6 0.0 0 (2 .3 6 2) M IN . N O TES : 1. C O M F O R M S T O E IA -41 8 . 2. C O N T R O L LIN G D IM E N S IO N : M ILL IM E T E R . 3. D IM E N S IO N M E A S U R E D @ H U B . 4. IN C L U D E S F L A N G E D IS T O R T IO N @ O U T E R E D G E . 26 .40 (1.039) 24 .40 (.961) 3 3 0.4 0 (1 .1 97 ) MAX. 4 WORLD.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
IRL3103 N-Channel MOSFET INCHANGE
IRL3103S N-Channel MOSFET INCHANGE
IRL3705N N-Channel MOSFET INCHANGE
IRL3705NL N-Channel MOSFET INCHANGE
IRL3705NPBF N-Channel MOSFET INCHANGE

Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IRL3102SPBF POWER MOSFET
IRL3102 Power MOSFET
IRL3102PBF HEXFET Power MOSFET
IRL3103 Power MOSFET
IRL3103D1 MOSFET & SCHOTTKY RECTIFIER

Full PDF Text Transcription

Click to expand full text
PD 9.1691A PRELIMINARY l l l l l IRL3102S HEXFET® Power MOSFET D Advanced Process Technology Surface Mount Optimized for 4.5V-7.0V Gate Drive Ideal for CPU Core DC-DC Converters Fast Switching VDSS = 20V G S RDS(on) = 0.013W ID = 61A Description These HEXFET Power MOSFETs were designed specifically to meet the demands of CPU core DC-DC converters. Advanced processing techniques combined with an optimized gate oxide design results in a die sized specifically to offer maximum efficiency at minimum cost. The D2Pak is a surface mount power package capable of accommodating die sizes up to HEX-4. It provides the highest power capability and the lowest possible onresistance in any existing surface mount package.
Published: |