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IR0530CSPTRPBF - FlipKY

Description

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.

Features

  • Ultra Low VF To Footprint Area.
  • Very Low Profile (.

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Other Datasheets by International Rectifier (now Infineon)

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Full PDF Text Transcription

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Bulletin I0175J rev. C 05/06 www.DataSheet4U.com IR0530CSPTRPbF FlipKYTM 0.5 Amp 30 Volt Features • Ultra Low VF To Footprint Area • • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Lead-Free ("PbF" suffix) Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 μs sine VF TJ @ 0.5 Apk, TJ=125°C range Values 0.5 30 190 0.33 - 55 to 150 Units A V A V °C Description International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.
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