Datasheet4U Logo Datasheet4U.com

IR0530CSP - FlipKY 0.5Amp

Description

International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry.

The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.08mm2 of board space.

Features

  • Ultra Low VF To Footprint Area.
  • Very Low Profile (.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer

Other Datasheets by International Rectifier (now Infineon)

Part Number Description
IR0530CSPTRPBF FlipKY
IR05H40CSPTR FlipKY
IR01D214 (IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE
IR01D224 (IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE
IR01D420 (IR01H(D)xxx) HIGH VOLTAGE HALF BRIDGE

Full PDF Text Transcription

Click to expand full text
Preliminary Data Sheet I0174J rev. A 06/05 IR0530CSP FlipKYTM 0.5 Amp 30 Volt www.DataSheet4U.com Features • Ultra Low VF To Footprint Area • • • Very Low Profile (<0.6mm) Low Thermal Resistance Supplied Tested And On Tape & Reel Applications • Reverse Polarity Protection • • • • Current Steering Freewheeling Flyback Oring FlipKYTM Major Ratings and Characteristics Characteristics IF(AV) Rectangular waveform VRRM IFSM @ tp = 5 µs sine VF TJ @ 0.5 Apk, TJ=125°C range IR0530CSP 0.5 30 190 0.33 - 55 to 150 Units A V A V °C Description International Rectifier's FlipKY product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9mm x 1.2mm devices can deliver up to 0.5A and occupy only 1.
Published: |