N0014EU Key Features
- Low Input Capacitance: 2.3pF Typical
- Low Gate Leakage: 1.5pA Typical
- High Breakdown Voltage: -30V Typical
- High Input Impedance
- Die Size: 482um X 482um X 203um
- Bond Pads: 90um Diameter
- Substrate Connected to Gate
- Au Back Side Finish
- Flip Chip Bumped Package Option