Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state-of-the-art BGA packaging, the FDZ2554P minimizes both PCB space and RDS(ON).
Features
- 6.5 A,.
- 20 V. RDS(ON) = 28 mΩ @ VGS =.
- 4.5 V RDS(ON) = 45 mΩ @ VGS =.
- 2.5 V.
- Occupies only 0.10 cm2 of PCB area: 1/3 the area of SO-8.
- Ultra-thin package: less than 0.90 mm height when mounted to PCB.
- Outstanding thermal transfer characteristics: significantly better than SO-8.
- Ultra-low Qg x RDS(ON) figure-of-merit.
- High power and current handling capability.
FDZ2554P Datasheet
