Description
Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ2552P minimizes both PCB space and RDS(ON).
Features
- =.
- 6 A,.
- 20 V. RDS(ON) = 0.045 Ω @ VGS =.
- 4.5 V RDS(ON) = 0.075 Ω @ VGS =.
- 2.5 V.
- = Occupies only 0.10 cm2 of PCB area. 1/3 the area of SO-8.
- = Ultra-thin package: less than 0.70 mm height when mounted to PCB.
- = Outstanding thermal transfer characteristics: significantly better than SO-8.
- = Ultra-low Qg x RDS(ON) figure-of-merit.
- = High power and current handling capability.
FDZ2552P Datasheet
