Datasheet4U Logo Datasheet4U.com

FDZ206P - P-Channel 2.5V Specified PowerTrench

General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS(ON).

Key Features

  • 13 A,.
  • 20 V. RDS(ON) = 9.5 mΩ @ VGS =.
  • 4.5 V RDS(ON) = 14.5 mΩ @ VGS =.
  • 2.5 V.
  • Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8.
  • Ultra-thin package: less than 0.80 mm height when mounted to PCB.
  • 0.65 mm ball pitch.
  • 3.5 x 4 mm2 footprint.
  • High power and current handling capability.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
FDZ1905PZ P-Channel MOSFET ON Semiconductor
FDZ5013 Frequency Doubler Tyco
FDZ5013 Frequency Doubler MA-COM
FDZ5013C Frequency Doubler Tyco
FDZ5013C Frequency Doubler MA-COM

Other Datasheets by Fairchild (now onsemi)

Part Number Description
FDZ201N N-Channel 2.5V Specified PowerTrenchTM BGA MOSFET
FDZ202P P-Channel 2.5V Specified PowerTrenchTM BGA MOSFET
FDZ203N N-Channel 2.5V Specified PowerTrench BGA MOSFET
FDZ2040L Integrated Load Switch
FDZ204P P-Channel 2.5V Specified PowerTrench

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
FDZ206P January 2003 FDZ206P P-Channel 2.5V Specified PowerTrench BGA MOSFET   General Description Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ206P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON). Features • –13 A, –20 V. RDS(ON) = 9.5 mΩ @ VGS = –4.5 V RDS(ON) = 14.5 mΩ @ VGS = –2.5 V • Occupies only 14 mm2 of PCB area. Only 42% of the area of SO-8 • Ultra-thin package: less than 0.80 mm height when mounted to PCB • 0.65 mm ball pitch • 3.