W3H64M72E-XSBX 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

White Electronic Designs

Description

White Electronic Designs W3H64M72E-XSBX ADVANCED * www.DataSheet4U.com 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package .
Symbol ODT Type Input Description W3H64M72E-XSBX ADVANCED. www.

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Datasheet Specifications

Part number: W3H64M72E-XSBX
Manufacturer: White Electronic Designs
File Size: 0.96 MB
Datasheet: W3H64M72E-XSBX_WhiteElectronicDesigns.pdf
Description: 64M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

Features

* Data rate = 667
* , 533, 400 Package:
* 208 Plastic Ball Grid Array (PBGA), 17 x 23mm
* 1.0mm pitch DDR2 Data Rate = 667
* , 533, 400 Core Supply Voltage = 1.8V ± 0.1V I/O Supply Voltage = 1.8V ± 0.1V - (SSTL_18 compatible) Differential data strobe (DQS, DQS#) per byte Internal,

Applications

* Upgradable to 128M x 72 density (contact factory for information)
* This product is under development, is not qualiﬁed or characterized and is subject to change or cancellation without notice. FIGURE 1
* DENSITY COMPARISONS Actual Size W3H64M72E-XSBX 11.0 CSP Approach (mm) 11.0 11.0 11

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W3H64M72E-XSBX 64M DDR2 SDRAM 208 PBGA Multi-Chip Package White Electronic Designs

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