W3H32M72E-XSBX 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

White Electronic Designs

Description

White Electronic Designs W3H32M72E-XSBX PRELIMINARY * 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package .
Symbol ODT Type Input Description W3H32M72E-XSBX PRELIMINARY. On-Die termination: ODT (registered HIGH) enables termination resistance internal.

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Datasheet Specifications

Part number: W3H32M72E-XSBX
Manufacturer: White Electronic Designs
File Size: 965.20 KB
Datasheet: W3H32M72E-XSBX_WhiteElectronicDesigns.pdf
Description: 32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package

Features

* Data rate = 667
* , 533, 400 Package:
* 208 Plastic Ball Grid Array (PBGA), 18 x 20mm
* 1.0mm pitch Differential data strobe (DQS, DQS#) per byte www. DataSheet4U. com Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS trans

Applications

* Upgradable to 64M x 72 density (contact factory for information)
* This product is under development, is not qualiﬁed or characterized and is subject to change without notice. FIGURE 1
* DENSITY COMPARISONS Actual Size W3H32M72E-XSBX 11.0 CSP Approach (mm) 11.0 11.0 11.0 11.0 20 19.0

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W3H32M72E-XSBX 32M DDR2 SDRAM 208 PBGA Multi-Chip Package White Electronic Designs

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