W3H32M64E-XSBX 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package

White Electronic Designs

Description

White Electronic Designs W3H32M64E-XSBX ADVANCED * www.DataSheet4U.com 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package .

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Datasheet Specifications

Part number: W3H32M64E-XSBX
Manufacturer: White Electronic Designs
File Size: 254.37 KB
Datasheet: W3H32M64E-XSBX_WhiteElectronicDesigns.pdf
Description: 32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package

Features

* Data rate = 667
* , 533, 400 Package:
* 208 Plastic Ball Grid Array (PBGA), 16 x 20mm
* 1.0mm pitch DDR2 Data Rate = 667
* , 533, 400 Supply Voltage = 1.8V ± 0.1V Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch archi

Applications

* Upgradeable to 64M x 64 density (contact factory for information) FIGURE 1
* DENSITY COMPARISONS Actual Size W3H32M64E-XSBX 11.0 White Electronic Designs W3H32M64E-XSBX CSP Approach (mm) 11.0 11.0 11.0 19.0 90 FBGA 90 FBGA 90 FBGA 90 FBGA 20 16 S A V I N G S 62% 42% Area I/O Count

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W3H32M64E-XSBX 32M DDR2 SDRAM 208 PBGA Multi-Chip Package White Electronic Designs

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