Datasheet4U Logo Datasheet4U.com

IRF6621 - Power MOSFET

Description

The IRF6621 combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile.

Features

  • Typical Source-Drain Diode Forward Voltage Typical VGS(th) Gate threshold Voltage (V) Fig11. Maximum Safe Operating Area 2.5 60 50 ID, Drain Current (A) 40 30 20 10 0 25 50 75 100 125 150 TC , Case Temperature (°C) 2.0 ID = 250µA 1.5 1.0 -75 -50 -25 0 25 50 75 100 125 150 TJ , Junction Temperature ( °C ) Fig 12. Maximum Drain Current vs. Case Temperature 60 Fig 13. Typical Threshold Voltage vs. Junction Temperature ID 3.0A 4.3A BOTTOM 9.6A TOP EAS, Single Pulse Avalanche Energy (mJ).

📥 Download Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
PD - 97005 IRF6621 DirectFET™ Power MOSFET ‚ l l l l l l l l l RoHs Compliant Containing No Lead and Bromide  Low Profile (<0.7 mm) Dual Sided Cooling Compatible  Ultra Low Package Inductance Optimized for High Frequency Switching  Ideal for CPU Core DC-DC Converters Optimized for both Sync.FET and some Control FET application Low Conduction and Switching Losses Compatible with existing Surface Mount Techniques  Typical values (unless otherwise specified) VDSS Qg tot VGS Qgd 4.2nC RDS(on) Qgs2 1.0nC RDS(on) Qoss 6.9nC 30V max ±20V max 7.0mΩ@ 10V 9.3mΩ@ 4.5V Qrr 10nC Vgs(th) 1.8V 11.7nC SQ Applicable DirectFET Outline and Substrate Outline (see p.
Published: |