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IDC40D120T6H
Diode EMCON 4 High Power Chip
FEATURES: • 1200V EMCON 4 technology • soft, fast switching
This chip is used for: • medium / high power modules
A
• low reverse recovery charge
• small temperature coefficient
C
Applications:
• medium / high power drives
Chip Type IDC40D120T6H
VR
IF
1200V 75A
Die Size 6.30 x 6.30 mm2
Package sawn on foil
MECHANICAL PARAMETER: Raster size Area total / active Anode pad size Thickness Wafer size Flat position Max. possible chips per wafer Passivation frontside Pad metall Backside metall
Die bond Wire bond Reject ink dot size Recommended storage environment
6.30 x 6.30 39.69 / 29.98
mm2
5.346 x 5.
IDC40D120T6H Datasheet
