Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. Low profile surface mounted application in order to optimize board space. Small plastic SMD package. High surge and high current capabili.

SUF11M

SUF11FL

SUF1002

SUF101A

SUF101ACR-C

SUF101AM

SUF101AR-C

SUF101DT

SUF101RT

SUF102A

SUF102ACR-C

SUF102AM

SUF102AR-C

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