z Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance. z Low profile surface mounted application in order to optimize board space. z Small plastic SMD package. z High surge and high current .

SUF11FL

SUF11MH

SUF1002

SUF101A

SUF101ACR-C

SUF101AM

SUF101AR-C

SUF101DT

SUF101RT

SUF102A

SUF102ACR-C

SUF102AM

SUF102AR-C

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