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MA4SPS502 Datasheet Preview

MA4SPS502 Datasheet

PIN Diode

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MA4SPS502
SURMOUNTTM PIN Diode
Rev. V3
Features
Surface Mount Device
No Wire Bonding Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
Low Parasitic Capacitance and Inductance
Higher Average and Peak Power Handling
RoHS* Compliant and 260°C Reflow Compatible
Case Style Outline Drawing ODS-12701,2
Description and Applications
This device is a silicon-glass PIN diode chip fabri-
cated with M/A-COM Technology Solutions patented
HMICTM process. This device features two silicon
pedestals embedded in a low loss glass. The diode is
formed on the top of one pedestal and connections to
the backside of the device are facilitated by making
the pedestal sidewalls conductive. Selective back-
side metalization is applied producing a surface
mount device. The topside is fully encapsulated with
silicon nitride and has an additional polymer layer for
scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge
during handling and assembly.
These packageless devices are suitable for usage in
moderate incident power (10 W C.W.) or higher
incident peak power (500 W) series, shunt, or series-
shunt switches. Small parasitic inductance, 0.35 nH,
and an excellent RC time constant, 0.22 pS, make
these devices ideal for switch applications where
higher P1dB and IP3 values are required. These
diodes can also be used in p, T, tapered resistance,
and switched-pad attenuator control circuits for 50W
or 75W systems.
Ordering Information
Tape and Reel
Gel Pack (100 pieces)
Pocket Tape (3000 pieces)
MA4SPS502
MADP-000502-12700P
1. Backside metal: 0.1 µM thick.
2. Hatched areas indicate backside ohmic gold contacts.
INCHES
MM
DIM
Min. Max. Min. Max.
A 0.058 0.062 1.47 1.57
B 0.026 0.030 0.66 0.76
C 0.004 0.006 0.10 0.15
D 0.020 0.022 0.51 0.56
E 0.013 0.015 0.33 0.38
Absolute Maximum Ratings @ TAMB = 25°C
Parameter
Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated Power
( RF & DC )
Absolute Maximum
600mA
| -275 V |
-65°C to +125°C
-55 °C to +150°C
+175°C
3W
* Restrictions on Hazardous Substances, European Union Directive 2002/95/EC.
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support




MA-COM

MA4SPS502 Datasheet Preview

MA4SPS502 Datasheet

PIN Diode

No Preview Available !

MA4SPS502
SURMOUNTTM PIN Diode
Symbol
CT
RS
VF
VR
IR
θJL
TL
Electrical Specifications @ TAMB = +25°C
Conditions
-40V, 1MHz
-40V, 1GHz
100mA, 100MHz
20mA, 100MHz
10mA
10μA
-200V
-40V
Steady State
+10mA / -6mA
( 50% - 90% V )
Units
pF
pF
V
V
μA
nA
°C/W
μS
Min.
| -200 |
Typical
0.140
0.090
1.4
2.4
0.87
| -275 |
8
50
2.8
Rev. V3
Max.
0.200
2.2
3.2
1.00
| -10 |
Handling
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individ-
ual components. Bulk handling should ensure that
abrasion and mechanical shock are minimized.
Die Attach
Attachment to a circuit board is made simple through
the use of surface mount technology. Mounting pads
are conveniently located on the bottom surface of
these devices and are removed from the active junc-
tion locations. These devices are well suited for solder
attachment onto hard and soft substrates. The use of
80/20, Au/Sn or RoHS compliant solders is recom-
mended. A conductive silver epoxy may also be
used .
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing a vac-
uum tip and force of 60 to 100 grams applied to the top
surface of the device. When soldering to soft substrates, it
is recommended to use a Gold-Tin interface at the circuit
board mounting pads. Position the device so that its
mounting pads are force aligned with the circuit board
mounting pads and reflow the solder by heating the circuit
trace near the mounting pads while applying 60 to 100
grams of perpendicular to the top surface of the die.
The solder joint must not be made one pad at a time.
Doing so could create unequal heat flow and produce
thermal and/or mechanical stresses. It is also not recom-
mended to reflow solder by causing heat to flow through
the top surface of the die. Since the HMIC glass is trans-
parent, the edges of the mounting pads can be visually
inspected through the die after attach is completed.
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support


Part Number MA4SPS502
Description PIN Diode
Maker MA-COM
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MA4SPS502 Datasheet PDF






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