* Surface Mount Device
* No Wire Bonding Required
* Rugged Silicon-Glass Construction
* Silicon Nitride Passivation
* Polymer Scratch Protection
*.

This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This.

and Applications This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedest.

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