Datasheet4U Logo Datasheet4U.com

MA4SPS502 - PIN Diode

Download the MA4SPS502 datasheet PDF. This datasheet also covers the MA4SPS502-MA variant, as both devices belong to the same pin diode family and are provided as variant models within a single manufacturer datasheet.

General Description

This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process.

Key Features

  • Surface Mount Device.
  • No Wire Bonding Required.
  • Rugged Silicon-Glass Construction.
  • Silicon Nitride Passivation.
  • Polymer Scratch Protection.
  • Low Parasitic Capacitance and Inductance.
  • Higher Average and Peak Power Handling.
  • RoHS.
  • Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (MA4SPS502-MA-COM.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

Part Number Description Manufacturer
MA4SPS552 Surface Mount Monolithic PIN Diode Chip Tyco Electronics
MA4SPS302 Surface Mount Monolithic PIN Diode Chip Tyco
MA4SPS420 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics
MA4SPS421 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics
MA4SPS422 (MA4SPS420 Series) SURMOUNT PIN Diodes Tyco Electronics

Other Datasheets by MACOM Technology Solutions

Part Number Description
MA4SPS402 PIN Diode
MA4SW110 Silicon PIN Diode Switches
MA4SW310 Silicon PIN Diode Switches
MA4SW410B-1 Silicon SP4T PIN Diode Switch
MA40016 Ceramic Packaged Silicon Schottky Mixer Diodes

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
MA4SPS502 SURMOUNTTM PIN Diode Rev. V3 Features  Surface Mount Device  No Wire Bonding Required  Rugged Silicon-Glass Construction  Silicon Nitride Passivation  Polymer Scratch Protection  Low Parasitic Capacitance and Inductance  Higher Average and Peak Power Handling  RoHS* Compliant and 260°C Reflow Compatible Case Style Outline Drawing ODS-12701,2 Description and Applications This device is a silicon-glass PIN diode chip fabricated with M/A-COM Technology Solutions patented HMICTM process. This device features two silicon pedestals embedded in a low loss glass. The diode is formed on the top of one pedestal and connections to the backside of the device are facilitated by making the pedestal sidewalls conductive.