rce Current (A) 100 BOTTOM ID, Drain-to-Source Current (A) 100 BOTTOM 10 10 1 2.3V 0.1 0.1 1 2.3V ≤60μs PULSE WIDTH Tj = 25°C 1 100 0.1 1 10 ≤60μs PULSE WIDTH T.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques. Application note AN-1035 is follo.

The IRF6728MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.7 mm profile. The DirectFET packag.

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