0.0V 5.00V 4.50V 4.00V 3.50V 3.25V 3.00V 2.75V 10 2.75V ≤60µs PULSE WIDTH Tj = 150°C 1 0.1 1 10 100 1000 VDS, Drain-to-Source Voltage (V) Fig 5. Typical Output Chara.

PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is .

The IRF6714MPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to achieve the lowest on-state resistance in a package that has the footprint of a SO-8 and only 0.6 mm profile. The DirectFET packag.

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