H9DA4GH4JJAMCR 2cs) equivalent, nand 4gb(x16) / mobile ddr 4gb(x32 2cs).
[ MCP ]
* Operation Temperature - -30oC ~ 85oC
* Packcage - 137-ball FBGA - 10.5x13.0mm2, 1.2t, 0.8mm pitch - Lead & Halogen Free [ NAND Flash ]
* Multiplane .
and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Mar. 2011 1
datasheet pdf - http://www.DataSheet4U.net/
H9DA4GH4JJAMCR series NAND 4Gb(x16) /.
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