H9DA4GH4JJAMCR - NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)

Datasheet Summary

Description

and is subject to change without notice.

Hynix does not assume any responsibility for use of circuits described.

No patent licenses are implied.

Features

[ MCP ].
Operation Temperature - -30oC ~ 85oC.
Packcage - 137-ball FBGA - 10.5x13.0mm2, 1.2t, 0.8mm pitch - Lead & Halogen Free [ NAND Flash ].
Multiplane Architecture.
Supply Voltage - Vcc = 1.7 - 1.95 V.
Memory Cell Array - (1K + 32) words x 64 pages x 4096 blocks.
Page Size - (1K+ 32 spare) Words.
Block Size - (64K + 2K spare) Words.
Page Read / Program - Random access : 25us (max. ) - Sequential access : 45ns (min. ) - Page program time : 250us (typ. ) -.

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Datasheet Details

Part number	H9DA4GH4JJAMCR
Manufacturer	Hynix
File Size	4.02 MB
Description	NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS)
Datasheet	H9DA4GH4JJAMCR Datasheet
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MCP Specification 4Gb (256Mb x16) NAND Flash + 4Gb (64Mb x32 2/CS 2CKE) mobile DDR http://www.DataSheet4U.net/ This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for use of circuits described. No patent licenses are implied. Rev 1.1 / Mar. 2011 1 datasheet pdf - http://www.DataSheet4U.net/ H9DA4GH4JJAMCR series NAND 4Gb(x16) / mobile DDR 4Gb(x32 2CS) Document Title MCP 4Gb (256Mb x16) NAND Flash / 4Gb (2*64Mb x32 2CS 2CKE) DDR Revision History Revision No. 0.1 1.0 1.1 History Initial Draft - 4Gb NAND Flash D-Die - 4Gb mobile DDR (2 x 2Gb Mobile DDDR A-Die) First version Editorial Change Draft Date Oct. 2010 Nov. 2010 Mar. 2011 Remark Preliminary http://www.DataSheet4U.net/ Rev 1.1 / Mar.

Published: Jun 27, 2013 |