Full PDF Text Transcription for HSMS-H690 (Reference)
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HSMS-H690. For precise diagrams, and layout, please refer to the original PDF.
H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Op...
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Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, prod
HSMS-H690 Datasheet
