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HSMS-H670 - Surface Mount Flip Chip LEDs

Download the HSMS-H670 datasheet PDF. This datasheet also covers the HSMS-H690 variant, as both devices belong to the same surface mount flip chip leds family and are provided as variant models within a single manufacturer datasheet.

Description

The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs.

The internal flip chip construction eliminates the wire bond between the chip and printed circuit board.

Consequently as a result of the robust construction, product reliability is greatly improved.

Features

  • Improved Reliability Through Elimination of Internal Wire Bond.
  • -40 to 85°C Operating Temperature Range.
  • Small Size.
  • Industry Standard Footprint.
  • Diffused Optics.
  • Compatible with IR Solder Process.
  • Four Colors Available.
  • Available in 8 mm Tape on 7" (178 mm) Diameter Reels.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (HSMS-H690-HP.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number HSMS-H670
Manufacturer HP
File Size 229.21 KB
Description Surface Mount Flip Chip LEDs
Datasheet download datasheet HSMS-H670 Datasheet

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Other Datasheets by HP

Part Number Description
HSMS-H690 Surface Mount Flip Chip LEDs
HSMS-2810 Surface Mount RF Schottky Barrier Diodes
HSMS-2812 Surface Mount RF Schottky Barrier Diodes
HSMS-2813 Surface Mount RF Schottky Barrier Diodes
HSMS-2814 Surface Mount RF Schottky Barrier Diodes

Full PDF Text Transcription

Click to expand full text
H Surface Mount Flip Chip LEDs Technical Data HSMX-H670 Series HSMX-H690 Series Features • Improved Reliability Through Elimination of Internal Wire Bond • -40 to 85°C Operating Temperature Range • Small Size • Industry Standard Footprint • Diffused Optics • Compatible with IR Solder Process • Four Colors Available • Available in 8 mm Tape on 7" (178 mm) Diameter Reels Applications • Keypad Backlighting • LCD Backlighting • Symbol Backlighting • Front Panel Indicator Description The HSMX-H670 and HSMX-H690 introduce a revolutionary concept to the world of LEDs. The internal flip chip construction eliminates the wire bond between the chip and printed circuit board. Consequently as a result of the robust construction, product reliability is greatly improved.
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