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l RF capable MOSFETs l Double metal process for low gate resistance l Rugged polysilicon gate cell structure l Unclamped Inductive Switching (UIS) rat...
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1.6 mm (0.063 in.) from case for 10 s 50/60 Hz, RMS Mounting torque t = 1 min
300 2500
0.4/6 Nm/lb-in
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Silicon chip on Direct-Copper-B...
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z Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation z Low drain to tab ca...
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1.6 mm (0.062 in.) from case for 10 s Plastic body for 10 seconds Mounting torque TO-220 TO-263 (TO-220)
300 260
1.13/10 Nm/lb.in. 4 3 g g
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1.6 mm (0.062 in.) from case for 10 s Maximum tab temperature for soldering TO-263 package for 10s Mounting torque TO-220 TO-263 (TO-220)
300 ...
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Maximum Lead Temperature for Soldering 1.6 mm (0.062 in.) from Case for 10 50/60Hz IISOL ≤ 1mA
www.DataSheet4U.net
300 260 2500 3000 1.5/13 1.3/...
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• Silicon chip on Direct-Copper-Bond
Maximum lead temperature for soldering Plastic body for 10s 50/60 Hz, RMS, 1 minute Mounting force
300 260 250...
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Double metal process for low gate resistance Unclamped Inductive Switching (UIS) rated Low package inductance - easy to drive and to prote...
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z International standard packages z Fast intrinsic diode z Unclamped Inductive Switching (UIS) rated z Low package inductance - easy to drive and to p...