Toshiba |
THGBMBG5D1KBAIL |
4GB density e-MMC |
|
KIOXIA |
THGBMJG6C1LBAIL |
8GB density of e-MMC Module |
Intel Corporation |
8272 |
Single / Double Density Floppy Disk Controller |
Kexin Semiconductor |
PC817 |
High Density Mounting Photocoupler |
Texas Instruments |
TPS631000 |
High Power Density Buck-Boost Converter |
Sharp Corporation |
PC818 |
High Density Mounting Type Photocoupler |
|
Toshiba |
THGBMHG7C1LBAIL |
16GB density of e-MMC Module |
HOLTIC |
HI-3220 |
High Density 16Rx / 8Tx or 8Rx / 4Tx ARINC 429 Protocol IC |
Hitachi Semiconductor (now Renesas) |
HB56A440BR |
(HB56A840BR / HB56A440BR) 40-Bit High Density DRAM Module |
Renesas |
72V3680 |
HIGH-DENSITY 36-BIT FIFO |
|
Unknown Manufacturer |
QL4016-4CF100C |
16/000 Usable PLD Gate QuickRAM ESP Combining Performance/ Density and Embedded RAM |
QuickLogic Corporation |
QL3060 |
PLD Gate pASIC 3 FPGA Combining High Performance and High Density |
SAFT |
LS17500 |
Primary lithium-thionyl chloride (Li-SOCl2)High energy density A-size bobbin cell |
STMicroelectronics |
STM32F103RG |
XL-density performance line ARM-based 32-bit MCU |
|
TAISOX |
9003 |
High Density Polyethylene |
|
Unknown Manufacturer |
QL2009-XPQ208C |
and pASIC 2 FPGA Combining Speed/ Density/ Low Cost and Flexibility |
|
Unknown Manufacturer |
QL4016-2PLI |
16/000 Usable PLD Gate QuickRAM ESP Combining Performance/ Density and Embedded RAM |
Integrated Device Tech |
IDT72V233 |
3.3 VOLT HIGH-DENSITY SUPERSYNC NARROW BUS FIFO |
|
Unknown Manufacturer |
QL4016 |
16/000 Usable PLD Gate QuickRAM ESP Combining Performance/ Density and Embedded RAM |
|
Unknown Manufacturer |
QL4016-4PLM |
16/000 Usable PLD Gate QuickRAM ESP Combining Performance/ Density and Embedded RAM |
