THGBMJG6C1LBAIL - 8GB density of e-MMC Module

Product Overview

Part number	THGBMJG6C1LBAIL
Manufacturer	KIOXIA
File Size	641.92 KB
Description	8GB density of e-MMC Module
Datasheet	THGBMJG6C1LBAIL Datasheet
Additional preview pages of the THGBMJG6C1LBAIL datasheet.

THGBMJG6C1LBAIL Interface THGBMJG6C1LBAIL has the JEDEC / MMCA Version 5.1 interface with 1-I/O, 4-I/O and 8-I/O mode. Pin Connection P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm(max. ) package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC NC 10 NC NC NC VSF VSF RFU VSS VCC RFU NC NC RFU 9 NC NC NC VSF VCC NC NC NC 8 NC NC NC RFU VSS NC NC NC 7 RFU NC NC VSS Top Vi.

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Published: Nov 1, 2025 |