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• 250 mW Rating on FR−4 or FR−5 Board • Zener Breakdown Voltage Range − 2.4 V to 75 V • Package Designed for Optimal Automated Board Assembly • Small ...
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• These diodes are also available in other case styles and other configurations including: the SOD-123 case with type designation BZT52 series, the ze...
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Planar Die Construction
350mW Power Dissipation 2.4V – 51V Nominal Zener Voltage 5% Standard Vz Tolerance Designed for Surface Mount Applica...
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* Zener breakdown voltage range - 2.0 V to 75 V * Package designed for optimal automated board assembly * Small package size for high density applicat...
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o l t s ) Impedance Vz1(Volts) @ I ZT2= 1 m A Z ZT2 @IZT1=5mA (Note1) ( Oh m s) (Note 1) @I ZT2 =5mA Min Max Min Max Max Zener Impedance Z ZT3 ( Oh m ...
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Planar die construction 200mW power dissipation Zener voltages from 2.4V - 39V Ultra-small surface mount package power dissipation
3
12
SOT-323
A...
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200mW Power Dissipation Rating. Zener Voltage form 2.4V~39V Planar Die Construction Three isolated diode elements in single Ultra-Small Mount Package
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Planar Die Construction. 200mW Power Dissipation Zener Voltages From 2.4V - 43V 5% Standard Vz Tolerance Designed for Surface Mount Applicat...
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Small Package : SOT-23 Normal Voltage Tolerance About
2.5%.
MAXIMUM RATING (Ta=25 )
CHARACTERISTIC
SYMBOL
Power Dissipation Junction Temperature
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• Silicon planar Zener diodes
• The Zener voltages are graded according to the international E24 standard. Standard Zener voltage tolerance is ± 5 %, ...
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• Silicon planar Zener diodes
Available
• The Zener voltages are graded according to the international E24 standard. Standard Zener voltage toleran...
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2 Hits
• Planar Die Construction • 200mW Power Dissipation • Zener Voltages from 2.4V - 39V • Ultra-Small Surface Mount Package • Lead Free/RoHS Compliant (N...
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2 Hits
Planar Die construction 200mW Power Dissipation Zener Voltages from 2.4V - 39V Ideally Suited for Automated Assembly Processes . Halogen free availabl...
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2 Hits
• Zener breakdown voltage range – 2.0 V to 75 V • Package designed for optimal automated board
assembly • Small package size for high density applicat...