Datasheet4U Logo Datasheet4U.com

SN74AHCT16244 - 16-Bit Buffers/Drivers

Description

The SN74AHCT16244 device is a 16-bit buffer and line driver specifically designed to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

Features

  • 1 Members of the Texas Instruments Widebus™ Family.
  • EPIC™ (Enhanced-Performance Implanted CMOS) Process.
  • Inputs are TTL-Voltage Compatible.
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise.
  • Flow-Through Architecture Optimizes PCB Layout.
  • Latch-Up Performance Exceeds 250 mA Per JESD 17.
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015.
  • Package Options Include:.
  • Plastic Shrink Small Outline (.

📥 Download Datasheet

📁 Similar Datasheet

Part Number Description Manufacturer
SN74101 AND-OR Gate ETC
SN74102 AND Gate ETC
SN74103 Dual J-K Flip-Flop ETC
SN74106 Dual J-K Flip-Flop ETC
SN74108 Dual J-K Flip Flop ETC

Other Datasheets by Texas Instruments

Part Number Description
SN74AHCT16240 16-BIT BUFFERS/DRIVERS
SN74AHCT16245 16-Bit Bus Transceivers
SN74AHCT16373 16-Bit Transparent D-Type Latches
SN74AHCT16374 16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS
SN74AHCT16540 16-BIT BUFFERS/DRIVERS

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
Product Folder Sample & Buy Technical Documents Tools & Software Support & Community SN74AHCT16244 SCLS334J – MARCH 1996 – REVISED OCTOBER 2014 SN74AHCT16244 16-Bit Buffers/Drivers With 3-State Outputs 1 Features •1 Members of the Texas Instruments Widebus™ Family • EPIC™ (Enhanced-Performance Implanted CMOS) Process • Inputs are TTL-Voltage Compatible • Distributed VCC and GND Pins Minimize High-Speed Switching Noise • Flow-Through Architecture Optimizes PCB Layout • Latch-Up Performance Exceeds 250 mA Per JESD 17 • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015 • Package Options Include: – Plastic Shrink Small Outline (DL) Package – Thin Shrink Small Outline (DGG) Package – Thin Very Small Outline (DGV) Package – 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil
Published: |