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Not Recommended for New Designs
CSD25401Q3
www.ti.com
SLPS211C – AUGUST 2009 – REVISED APRIL 2013
P-Channel NexFET™ Power MOSFETs
Check for Samples: CSD25401Q3
FEATURES
1
•2 Ultra Low Qg and Qgd • Low Thermal Resistance • Low RDS(on) • Pb Free Terminal Plating • RoHS Compliant • Halogen Free • SON 3.3mm x 3.3mm Plastic Package
APPLICATIONS
• DC-DC Converters • Battery Management • Load Switch • Battery Protection
DESCRIPTION
The NexFET™ power MOSFET has been designed to minimize losses in power conversion load management applications. The SON 3×3 package offers excellent thermal performance for the size of the package.
Figure 1. Top View
D1
8S
Table 1. PRODUCT SUMMARY
VDS
Drain to Source Voltage
Qg
Gate Charge Total (4.
CSD25401Q3 Datasheet
