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VS-ENQ030L120S - EMIPAK-1B PressFit Power-Module

Description

VS-ENQ030L120S is an integrated solution for a neutral point clamp topology in a single package.

The EMIPAK-1B package is easy to use thanks to the PressFit pins and the exposed substrate provides improved thermal performance.

Features

  • Ultrafast Trench IGBT technology.

📥 Download Datasheet

Datasheet Details

Part number VS-ENQ030L120S
Manufacturer Vishay
File Size 428.64 KB
Description EMIPAK-1B PressFit Power-Module
Datasheet download datasheet VS-ENQ030L120S Datasheet

Full PDF Text Transcription

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www.vishay.com VS-ENQ030L120S Vishay Semiconductors EMIPAK-1B PressFit Power Module Neutral Point Clamp Topology, 30 A EMIPAK-1B (package example) FEATURES • Ultrafast Trench IGBT technology • HEXFRED® and silicon carbide diode technology • PressFit pins technology • Exposed Al2O3 substrate with low thermal resistance • Low internal inductances • PressFit pins locking technology. Patent # US.263.820 B2 • UL approved file E78996 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRODUCT SUMMARY TRENCH IGBT 1200 V STAGE VCES VCE(ON) typical at IC = 30 A 1200 V 2.12 V IC at TC = 102 °C 30 A TRENCH IGBT 600 V STAGE VCES VCE(ON) typical at IC = 30 A 600 V 1.
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