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SiHFU110 - Power MOSFET

Download the SiHFU110 datasheet PDF. This datasheet also covers the SiHFR110 variant, as both devices belong to the same power mosfet family and are provided as variant models within a single manufacturer datasheet.

General Description

Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness.

The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.

Key Features

  • Dynamic dV/dt Rating.
  • Repetitive Avalanche Rated.
  • Surface Mount (IRFR110, SiHFR110).
  • Available in Tape and Reel.
  • Fast Switching.
  • Ease of Paralleling.
  • Material categorization: For definitions of compliance please see www. vishay. com/doc?99912.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (SiHFR110_VishaySiliconix.pdf) that lists specifications for multiple related part numbers.

📁 Similar Datasheet

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SiHF074N65E Power MOSFET Vishay
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SiHF15N60E Power MOSFET Vishay

Other Datasheets by Vishay

Part Number Description
SiHFU120 Power MOSFET
SiHFU1N60A Power MOSFET
SiHFU014 Power MOSFET
SIHFU020 (SIHFR020 / SIHFU020) Power MOSFET
SiHFU024 Power MOSFET

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
www.vishay.com IRFR110, SiHFR110 Vishay Siliconix Power MOSFET PRODUCT SUMMARY VDS (V) RDS(on) () Qg (Max.) (nC) Qgs (nC) Qgd (nC) Configuration 100 VGS = 10 V 8.3 2.3 3.8 Single 0.54 D DPAK (TO-252) D G GS S N-Channel MOSFET FEATURES • Dynamic dV/dt Rating • Repetitive Avalanche Rated • Surface Mount (IRFR110, SiHFR110) • Available in Tape and Reel • Fast Switching • Ease of Paralleling • Material categorization: For definitions of compliance please see www.vishay.com/doc?99912 DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The DPAK is designed for surface mounting using vapor phase, infrared, or wave soldering techniques.