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SGA-5286Z - Cascadable SiGe HBT MMIC Amplifier

Download the SGA-5286Z datasheet PDF. This datasheet also covers the SGA-5286 variant, as both devices belong to the same cascadable sige hbt mmic amplifier family and are provided as variant models within a single manufacturer datasheet.

Description

The SGA-5286 is a high performance SiGe HBT MMIC Amplifier.

A Darlington configuration featuring 1 micron emitters provides high FT and excellent thermal perfomance.

The heterojunction increases breakdown voltage and minimizes leakage current between junctions.

Features

  • Now available in Lead Free, RoHS Compliant, & Green Packaging.
  • High Gain : 12.0 dB at 1950 MHz.
  • Cascadable 50 Ohm.
  • Operates From Single Supply.
  • Low Thermal Resistance Package Gain & Return Loss vs. Frequency VD= 3.5 V, ID= 60 mA (Typ. ) 20 15 Gain (dB) IRL 0 -10 -20 Return Loss (dB) GAIN.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (SGA-5286_SirenzaMicrodevices.pdf) that lists specifications for multiple related part numbers.

Datasheet Details

Part number SGA-5286Z
Manufacturer Sirenza Microdevices
File Size 91.28 KB
Description Cascadable SiGe HBT MMIC Amplifier
Datasheet download datasheet SGA-5286Z Datasheet

Full PDF Text Transcription (Reference)

The following content is an automatically extracted verbatim text from the original manufacturer datasheet and is provided for reference purposes only.

View original datasheet text
SGA-5286 Product Description The SGA-5286 is a high performance SiGe HBT MMIC Amplifier. A Darlington configuration featuring 1 micron emitters provides high FT and excellent thermal perfomance. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. Cancellation of emitter junction nonlinearities results in higher suppression of intermodulation products. Only 2 DC-blocking capacitors, a bias resistor and an optional RF choke are required for operation. The matte tin finish on Sirenza’s lead-free package utilizes a post annealing process to mitigate tin whisker formation and is RoHS compliant per EU Directive 2002/95. This package is also manufactured with green molding compounds that contain no antimony trioxide nor halogenated fire retardants.
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