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K4B2G1646C - 2Gb C-die DDR3 SDRAM

General Description

8 5.

DDR3 SDRAM Addressing 9 6.

Absolute Maximum Ratings 10 6.1 Absolute Maximum DC Ratings 10 6.2 DRAM Component Operating Temperature Range 10 7.

Key Features

  • 5 3. Package pinout/Mechanical Dimension & Addressing 6 3.1 x16 Package Pinout (Top view) : 96ball FBGA Package 6 3.2 FBGA Package Dimension (x16) 7 4. Input/Output Functional.

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Full PDF Text Transcription for K4B2G1646C (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for K4B2G1646C. For precise diagrams, and layout, please refer to the original PDF.

www.DataSheet.co.kr Rev. 1.11, Nov. 2010 K4B2G1646C 2Gb C-die DDR3 SDRAM Only x16 96FBGA with Lead-Free & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESE...

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ree & Halogen-Free (RoHS compliant) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel

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