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K4B1G0446D - 1Gb D-die DDR3 SDRAM Specification

General Description

11 5.0 DDR3 SDRAM Addressing 12 6.0 Absolute Maximum Ratings 13 6.1 Absolute Maximum DC Ratings 13 6.2 DRAM Component Operating Temperature Range 13 7.0 AC & DC Operating Conditions 13 7.1 Recommended DC operating Conditions (SSTL_1.5) 13 8.0 AC & DC Input Measurement Levels 14 8.1 AC and DC

Key Features

  • 5 3.0 Package pinout/Mechanical Dimension & Addressing 6 3.1 x4 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 6 3.2 x8 Package Pinout (Top view) : 82ball FBGA Package(78balls + 4 balls of support balls) 7 3.3 x16 Package Pinout (Top view) : 100ball FBGA Package(96balls + 4 balls of support balls) 8 3.4 FBGA Package Dimension (x4/x8) 9 3.5 FBGA Package Dimension (x16) 10 4.0 Input/Output Functional.

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Full PDF Text Transcription for K4B1G0446D (Reference)

Note: Below is a high-fidelity text extraction (approx. 800 characters) for K4B1G0446D. For precise diagrams, and layout, please refer to the original PDF.

K4B1G04(08/16)46D 1Gb DDR3 SDRAM 1Gb D-die DDR3 SDRAM Specification 82 / 100 FBGA with Lead-Free & Halogen-Free (RoHS Compliant) CAUTION : * This document includes some i...

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alogen-Free (RoHS Compliant) CAUTION : * This document includes some items still under discussion in JEDEC. * Therefore, those may be changed without pre-notice based on JEDEC progress. * And it’s highly recommended not to send the spec without Samsung’s permission. INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BAS

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