Datasheet4U Logo Datasheet4U.com

STP17NK40ZFP - N-CHANNEL Power MOSFET

Download the STP17NK40ZFP datasheet PDF. This datasheet also covers the STP17NK40Z variant, as both devices belong to the same n-channel power mosfet family and are provided as variant models within a single manufacturer datasheet.

Description

The SuperMESH™ series is obtained through an extreme optimization of ST’s well established stripbased PowerMESH™ layout.

In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications.

Features

  • OF GATE-TO-SOURCE ZENER DIODES The built-in back-to-back Zener diodes have specifically been designed to enhance not only the device’s ESD capability, but also to make them safely absorb possible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener diodes thus avoid the usage of external components. 2/10 www. DataS.

📥 Download Datasheet

Note: The manufacturer provides a single datasheet file (STP17NK40Z_STMicroelectronics.pdf) that lists specifications for multiple related part numbers.

Full PDF Text Transcription

Click to expand full text
www.DataSheet4U.com N-CHANNEL 400V - 0.23Ω - 15A TO-220/TO-220FP Zener-Protected SuperMESH™Power MOSFET TYPE STP17NK40Z STP17NK40ZFP s s s s s s STP17NK40Z - STP17NK40ZFP VDSS 400 V 400 V RDS(on) < 0.25 Ω < 0.25 Ω ID 15 A 15 A Pw 150 W 35 W TYPICAL RDS(on) = 0.23 Ω EXTREMELY HIGH dv/dt CAPABILITY 100% AVALANCHE TESTED GATE CHARGE MINIMIZED VERY LOW INTRINSIC CAPACITANCES VERY GOOD MANUFACTURING REPEATIBILITY 3 1 2 TO-220 TO-220FP DESCRIPTION The SuperMESH™ series is obtained through an extreme optimization of ST’s well established stripbased PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications.
Published: |