NLAS4684
features guaranteed Break Before Make switching, assuring the switches never short the driver.
The NLAS4684 is available in a 2.0 x 1.5 mm bumped die array. The pitch of the solder bumps is 0.5 mm for easy handling.
Features
- Ultra- Low RON, t0.5 W at 2.7 V
- Threshold Adjusted to Function with 1.8 V Control at
VCC = 2.7- 3.3 V
- Single Supply Operation from 1.8- 5.5 V
- Tiny 2 x 1.5 mm Bumped Die
- Low Crosstalk, t 83 d B at 100 k Hz
- Full 0- VCC Signal Handling Capability
- High Isolation,
- 65 d B at 100 k Hz
- Low Standby Current, t50 n A
- Low Distortion, t0.14% THD
- RON Flatness of 0.15 W
- Pin for Pin Replacement for MAX4684
- High Continuous Current Capability
$300 m A Through Each Switch
- Large Current Clamping Diodes at Analog Inputs
$300 m A Continuous Current Capability
- Pb- Free Packages are Available
Applications
- Cell Phone
- Speaker Switching
- Power Switching
- Modems
- Automotive http://onsemi.
MARKING DIAGRAMS
A1
Microbump- 10 CASE 489AA
4684 AYWWG
A1 G
DFN10 CASE...
