Click to expand full text
SIDC56D170E6
Fast switching diode chip in Emitter Controlled -Technology
A
Features:
This chip is used for:
• 1700V technology, Emitter Controlled • soft, fast switching
• power modules and discrete devices
• low reverse recovery charge • small temperature coefficient
Applications: • SMPS, resonant applications,
C
drives
Chip Type SIDC56 D170E6
VR
IF
1700V 75A
Die Size 7.5 x 7.5mm2
Package sawn on foil
Mechanical Parameter Raster size Area total Anode pad size Thickness Wafer size Max. possible chips per wafer Passivation frontside Pad metal
Backside metal
Die bond Wire bond Reject ink dot size Recommended storage environment
7.5 x 7.5 56.25
mm 2
5.48 x 5.
SIDC56D170E6 Datasheet
